Hynix outsources the HBM packaging step to TSMC because TSMC also manufactures GPUs for Nvidia. Compared to Nvidia, this collaboration model is more aligned with Hynix's future GPU design roadmap, reducing intermediate steps. This advantage far surpasses that of Micron and Samsung. This company is extremely undervalued. As GPU and memory integration increases, Hynix's value will be greatly amplified, and its product development efficiency will accelerate. Currently, Samsung benefits from its integrated production lines encompassing "memory + logic + foundry + packaging," significantly reducing costs through 3.3D packaging. However, when GPU and memory packaging become highly integrated, this will become a disadvantage. Hynix and Nvidia outsourcing all packaging to TSMC will become an advantage. Hynix and Nvidia can then focus on technological iteration, leaving production to TSMC.