Shenwan Hongyuan: Subsidiary's 3.1 billion yuan technology innovation corporate bonds will be listed on the Shenzhen Stock Exchange on May 11.
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According to ME News, on May 12 (UTC+8), Shenwan Hongyuan announced that the issuance of its subsidiary, Shenwan Hongyuan Securities, of the first tranche of technology innovation corporate bonds publicly offered to professional investors in 2026 concluded on April 29, with an issuance size of 3.1 billion yuan. Among them, tranche one has a size of 1.4 billion yuan, a term of 2 years, and a coupon rate of 1.65%; tranche two has a size of 1.7 billion yuan, a term of 3 years, and a coupon rate of 1.73%. After review by the Shenzhen Stock Exchange, these bonds were listed on the Shenzhen Stock Exchange on May 11 and are available for trading by institutional investors among professional investors. (Source: ME)
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