TrendForce: TSMC accelerates CoPoS development; glass substrates may achieve mass production after 2030.

According to ME News, a recent TrendForce report released on June 17th (UTC+8) indicates that the rapid growth in demand for AI semiconductors is driving the evolution of advanced packaging technologies, with fan-out panel-level packaging (FOPLP) becoming a new battleground in the industry. TSMC is currently focusing on the CoPoS packaging architecture and has standardized its use of the 310 × 310 mm panel format. 2026 is expected to be a critical verification period for related equipment and material suppliers, with the goal of entering pilot production in 2027 and mass production in the second half of 2028. In addition to CoPoS, TSMC's next focus is expected to shift to glass core substrates, with commercial-scale production potentially occurring after 2030. (Source: ME)